wafer.space Community - die imaging InfoSecDJ

3:05 p.m.

Yeah.

Unrelated beyond the information on http://infosecdj.net/ telling that you're experienced: The V2S200D sensor is a contact microphone supposedly sharing a readout ASIC with decently state of the art PDM MEMS microphones, but using a MEMS accelerometer in place of a MEMS sound pressure transducer https://www.syntiant.com/platform/sensors-and-microphones/v2s/ . They say it's vacuum sealed (the metal can has a pressure escape hole that's recommended to be sealed with resin after soldering if used in potentially corrosive environments). If you're interested in looking at one, I'll probably sponsor the expenses incurred (probably don't have the budget to cover your time though). I also have some Intel QSFP28 and almost identically made (pretty much has just two of the electro-optical units on the board) QSFP28-DD that are cut AOCs; if you'd be interested in imagining some I can probably find some with external damage to the gold finger connector or fiber damage too close to reasonably work with for splicing a pair of these "cut ends" back into a functional AOC. They are covered in transparent resin though. It's two sizable electronic dies (no signs of optical activity on them) that appear COB plus obscured area between them and the ends of the fibers. Each of the dies is connected to 4 unidirectional 25G lanes (and the top structure under the hacker space's amscope (sorry didn't have a laptop with suitable software for the camera on hand, and the visual quality I easily got through the resin was too bad to motivate much capturing effort that evening) suggests through 4 copies of a pattern towards the fibers). The RX and the TX die of each 100G section are right next to another sharing the encapsulation and the fiber termination block. On the QSFP28-DD there are just two of these units with one's bare (except for the colored cladding) fibers routed over top of the other from the strain relief cable termination. Feel free to DM me (but ping me here to ensure I notice without much delay); the transceiver has much more worth behind it. (...The others from the dismantled supercomputer are with us, and all the -DD along with two non-DD for each are cut...) [Though for many there are two non-DD cabled to a fork/splice-encapsulator with their cables coming out together on one end and a cable towards the -DD it belonged to going out the other for a good distance (1~10 m mostly) until it reached the wall penetration where we had done to do the cut to allow disassembly.]

diegoldx

v2s - Syntiant

V2S200D A First-of-its-Kind Digital Voice Vibration Sensor A high bandwidth, low-power specialized vibration sensor to improve voice call quality in noisy environments. More than ever, consumers use audio devices, such as True Wireless Stereo (TWS) earbuds, for voice communications and calling on the move, often in loud public environments. Outd...

5:10 p.m.

They are covered in transparent resin though.

It looks like there is a plastic piece around which precludes goop from touching the die itself. meaning, if one removes the plastic, there will be free access to the die.