wafer.space Community - Given the trouble with bonding I'm not

2:30 p.m.

True, that would introduce to many unknown variables until they yields are up. Also, having CUP IOs would probably put wedge bonding off the table (just to be safe).

2:36 p.m.

But technically, could this work, assuming we lived in a parallel dimension where I had access to unlimited termosonic bonding capabilities and yeild was not a problem ?

Sure if you follow CUP rules you could make another IO library. But note to gain any space you'd have to make some power rails thinner so you need to evaluate this and the impact for your library.

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2:54 p.m.

Because even without CUP on a full slot for instance you could have circuits on the side of the bond pads ... there is plenty of space in between.

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Thanks @tnt

Essen

But technically, could this work, assuming we lived in a parallel dimension where I had access to unlimited termosonic bonding capabilities and yeild was not a problem ?

I'd think a major potential might "instead" be to extend the pad area within the existing grid / IO-ring-slot to max out the bonding area for flip chip packaging even without throwing the existing ring scheme out the window. For wedge bonding you'd just be limited to (only) part of the pad.

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I think @stuart and @Lauri have solved the bonding reliability problems now. Still a few more tests to go but the last round was looking very good.

@tnt fwiw with the new bonding partners we're up at over 90% pass rate based on recent trials. This is based on only a couple of panels though, second trials of ~20 panels are in progress and will give us more data

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That is great news. On that topic, you tell us what type of bond this new bondhouse is doing @stuart : wedge/thermosonic/ect ?

gonna be al wedge I'm nearly certain

Essen

That is great news. On that topic, you tell us what type of bond this new bondhouse is doing @stuart : wedge/thermosonic/ect ?

We're trialling both alu wedge and gold thermosonic

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stuart

We're trialling both alu wedge and gold thermosonic

Nice, thanks