GlobalFoundries have confirmed the wafer out date is the 31st of March with delivery happening on the 1st of April. I will be personally heading to Singapore to look after the dicing, sorting and chip on board mounting. The hope is that people will get their parts back during April. For this reason I need to know where to ship the parts and if you want them chip-on-board packaged. Please get one person to fill out the form @ https://XXXXX once per project ID before 20th March (Friday next week). As this is the first run, I'm more flexible around deliver option being split between both chip-on-board mounted and bare die. * For people who are paid customers I will cross check this data against the information provided by Crowd Supply. * For people who are getting free silicon this is the only record I have of how to package and ship the parts. For the chip-on-board mounting we currently looking to work with the same supplier used by Tiny Tapeout. I'm excited that this is all progressing and at the recent Down Underflow event I was also happy to announce that the second run is launching, while the talk was not recorded you can find the slides at https://wafer.space/du26